Nanotechnologies are being applied to microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior mechanical, electrical, or thermal properties of carbon nanotubes. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancement. “Nanopackaging” is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of their field, and others with interests in nanotechnology. It will survey the application of nanotechnologies to electronics packaging, as represented by current research across the field.
Offers a comprehensive discussion of Nanoparticles and Carbon Nanotubes, and how and why they are rapidly becoming materials options for electronics packagingDiscusses the importance of computer modeling in nanopackaging and offers suggestions for implementationDiscusses Nanoparticles and their role in packaging, including basic properties and fabrication, and applications in resistors, capacitors, inductors, microvias and conductive adhesives, solder, underfill, and thermal managementDiscusses Carbon Nanotubes and their role in packaging, including basic properties and fabrication, and applications in solder, thermal management, and EMI controlBrings together a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends